There is still a meeting to open

NA
NA
NA
NA




Latest News

Paper Submission:
01/03/2025~31/05/2025

Third call for paper:
05/01/2025

Call for Sponsorship is released!


Important Dates

Abstract Submission:
10/01/2025 Extended to 10/02/2025
Abstract Decision Notification:
28/02/2025
Paper Submission:
01/03/2025~31/05/2025
Paper Final Decision Notification:
10/07/2025
Early Bird Registration:
01/08/2025
Conference Dates:
21/09/2025~26/09/2025




Invited Speakers

  • Prof. Guan-Jun ZHANG

    Member, IEEE

    Xi’an Jiaotong University, China

    Title: Surface secondary electron emission and charge trap parameters: physics, measurement and applications

  • Prof. Efim Oks

    Fellow, IEEE

    Tomsk State University of Control Systems and Radioelectronics (TUSUR), Russia

    Title: Fore-vacuum plasma source of electrons

  • Dr. Helena Kaufmann

    Research Engineer

    Siemens Energy Global GmbH & Co. KG

    Title: Plasma-cathode interaction in vacuum, unipolar and high-pressure arcs

  • Dr. Huantong SHI

    Xi’an Jiaotong University, China

    Title: Wire-shorted rod-pinch diode for flash x-ray radiography and dynamic x-ray diffraction

Welcome to the 31st International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)

The International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV) is a non-profit, international forum whose purpose is to encourage the advancement of the science and application of electrical insulation and Discharges in vacuum, primarily by conducting symposia for the exchange of scientific information. The Symposium is held biennially for the exchange of results, presentation of progress, and discussion of ideas and challenges for the future of Discharges and electrical insulation in vacuum. Both fundamental and applied aspects are covered. Symposium program consists of invited talks, invited oral contributions, and posters. Minicourses and informal discussions on relevant topics may also be offered in addition to the regular Symposium schedule.

The 31st ISDEIV will be held at Tianfu International Convention Center, Chengdu, China, from Sept. 21 to 26, 2025. The conference will be hosted by Sichuan University, and technically sponsored by IEEE DEIS.

In the meantime, please contact us if you have questions on any aspect of the conference.



/ // / / / / / / /